Powering the Next Wave of High-Speed Copper Interconnects for AI and HPC Data Centres
Meeting the AI Era’s Most Pressing Challenge — Data Movement
Artificial intelligence and high-performance computing (HPC) workloads are transforming the data centre landscape. Training and deploying ever-larger models drive a step change in bandwidth and latency requirements. As hyperscalers disaggregate CPUs, GPUs, NVMe storage and AI accelerators across racks, internal and external cabling becomes a performance-critical element. Conventional board traces or off-the-shelf cables no longer suffice.
Volex, a global leader in high-speed copper interconnects, is at the forefront of this shift. Leveraging decades of manufacturing expertise and a worldwide footprint, Volex delivers bespoke Direct Attach Copper (DAC), Active Copper Cable (ACC) and Active Electrical Cable (AEC) solutions from 10Gbps to 1.6Tbps - engineered specifically for AI and HPC environments.
Why Bespoke Matters: Custom Cable Assemblies
Traditional one-size-fits-all cables often fail under the electrical and thermal stress of dense AI racks. Volex’s approach is different. Each assembly is uniquely terminated at the factory and 100% tested for signal integrity with serial-number traceability. This preserves signal fidelity and reduces total system power and cost.
Design options include:
- Wide AWG range and foam-dielectric insulation for optimal reach, flexibility and bend radius
- Custom EEPROM programming for customer-specific pin mapping, firmware integration and
host control - Low Smoke Zero Halogen (LSZH) jackets and liquid-cooling variants for next-generation thermal designs
With local engineering teams and operations in 25 countries, and tariff-free factories across multiple regions, Volex can provide quick-turn prototypes and mass production without supply-chain friction.
Scaling From 400G to 1.6T:
A Portfolio Built for the Future
Low power consumption and heat dissipation
Complete cable assembly uniquely terminated at the factory to provide the most reliable operation
100% tested for signal integrity with serial number traceability
Volex offers one of the industry’s broadest copper portfolios:
QSFP28/56 DACs — 25G NRZ to 50G PAM4 per lane for 100G/200G aggregation
QSFP-DD and OSFP 400G/800G Cables — doubling lane count to 8×50G or 8×100G PAM4 for 400G and 800G networks with reaches up to 7m in active versions
400G and 800G AECs — DSP-based equalization to extend reach and improve BER, ideal for AI workloads with ultra-low latency
1.6T OSFP1600 AEC — 8 transmit/8 receive 224 Gbps PAM4 channels per module. Advanced DSP equalization boosts reach to 3m (vs. 1m passive) while keeping module power <30W and enabling air cooled and cold plate liquid cooled cooling options
This roadmap mirrors the industry refresh cycle, giving hyperscalers a clear migration path from 100G to 1.6T without abandoning copper’s cost and power advantages.
Intelligent Management with CMIS 5.x
High-speed cables are no longer passive links; they are software-defined assets. Volex integrates the Cable Management Interface Specification (CMIS) 5.x into its AEC products to enable:
- Dynamic configuration control of equalization, voltage and current draw based on workload
- Real-time health monitoring of power, signal integrity and error rates
- Remote firmware upgrades for continuous performance enhancement without manual swaps
Combined with Volex API-level integration, data centre operators can programmatically fine-tune cable behavior, detect and remediate faults and scale infrastructure for shifting AI workloads all from a central dashboard.
Thermal Innovation for Dense AI Racks
Thermal constraints are as critical as bandwidth.
Volex cables are engineered for low power dissipation and are offered in air-cooled and cold-plate liquid cooled variants to match the thermal strategy of next-gen racks. This flexibility helps customers delay expensive optical transitions while maintaining reliability in high-density deployments.
Applications Across the AI/HPC Stack
Volex interconnects are already enabling:
Massive AI Model Training
High throughput, low latency server-to-server links accelerate training cycles
Real-time Inference
400G/800G AECs reduce latency for edge AI and streaming analytics
A Global Partner for Hyperscale Growth
Beyond technology, Volex offers:
These advantages translate into faster time-to-market, lower total cost of ownership and future-proofed interconnect infrastructure for AI and HPC operators.
Conclusion: Copper Reinvented for the AI Age
The AI revolution is not only about GPUs and algorithms — it is also about moving petabytes of data with precision, speed and efficiency.
Volex’s high-speed copper interconnect portfolio, from 400G/800G AECs to the ground breaking 1.6T OSFP1600 AEC, redefines what copper can do in the data centre.
Coupled with intelligent management via CMIS 5.x and API integration, Volex delivers a uniquely customizable, low-power and high-reliability solution that helps hyperscale customers stay ahead of the curve.